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Thick Film Integrated Circuit Equipment Is Relatively Easy To Heat Well

The Thick Film Integrated Circuit process is the need for transistors, diodes, resistors and capacitors needed by the circuit to be fabricated on a small piece of silicon, glass or ceramic substrate with a certain process, then interconnected with a suitable process, and then packaged in A shell, so that the entire circuit size greatly reduced, the number of leads and welding points are greatly reduced. The integrated vision emerged in the late 1950s and early 1960s, and was implemented using silicon planar technology and thin film and thick film technology. The electronic integration technology is divided into a monolithic Thick Film Integrated Circuit based on a silicon planar process, a thin film technology-based thin film Thick Film Integrated Circuit and a thick film Thick Film Integrated Circuit based on screen printing technology.

The use of grinding, polishing, oxidation, diffusion, lithography, epitaxial growth, evaporation and a whole set of planar technology, in a small silicon single chip on the manufacture of transistors, diodes, resistors and capacitors and other components, and using a certain isolation technology The components are electrically isolated from each other. And then evaporates the aluminum layer on the surface of the silicon wafer and engraves the interconnection pattern with the photolithography technique, so that the components are interconnected into the complete circuit as needed to make the semiconductor monolithic Thick Film Integrated Circuit. With the monolithic Thick Film Integrated Circuit from small to medium scale to large-scale, ultra-large scale Thick Film Integrated Circuits, planar technology also will be developed. For example, diffusion doping switch to ion implantation doping process; UV light conventional lithography to a set of micro-processing technology, such as the use of electron beam exposure plate, plasma etching, reactive ion milling; epitaxial growth and the use of ultra-high vacuum molecules Epitaxial technology; the use of chemical vapor deposition process to manufacture polysilicon, silica and surface passivation film; interconnection line in addition to the use of aluminum or gold, but also the use of chemical vapor deposition of heavily doped polysilicon film and precious metal silicification Material film, and multi-layer interconnect structure and other processes.

The entire circuit of transistors, diodes, resistors, capacitors and inductors and other components and the interconnection between them, all with a thickness of 1 micron below the metal, semiconductor, metal oxide, a variety of metal mixed phase, alloy or insulating media film, and Through the vacuum evaporation process, sputtering process and electroplating process overlap. The Thick Film Integrated Circuit made with this process is called a thin film Thick Film Integrated Circuit.

Thin film Thick Film Integrated Circuit in the use of thin film technology, its material structure in two forms: one is the film field effect of cadmium sulfide and cadmium selenide transistor, but also can be used tellurium, indium, arsenic, nickel oxide and other materials to produce transistors; The other is thin film thermoelectric amplifiers. Thin film transistor reliability is poor, can not be made with the silicon plane process compared to the transistor, and thus completely composed of thin film circuit has no common practical value.

The practical application of thin film Thick Film Integrated Circuits are used in the mixing process, that is, the use of thin film technology in glass, glass-ceramic, glazed or polished alumina ceramic substrate preparation of passive components and circuit components between the interconnect, and then Thick Film Integrated Circuits, Transistors, diodes and other active devices of the chip and inconvenience with the film produced by the power resistance, large capacitance of the capacitor, inductance and other components with hot-pressing welding, ultrasonic welding, beam lead or bump flip-chip assembly into a piece Complete circuit.

Monolithic Thick Film Integrated Circuits and thin film and thick film Thick Film Integrated Circuits of these three processes have their own characteristics, can complement each other. The number of general-purpose circuits and standard circuits is large, and monolithic Thick Film Integrated Circuits can be used. The need for small or non-standard circuit, the general choice of mixed process, that is, the use of standardized monolithic Thick Film Integrated Circuits, coupled with active and passive components of the hybrid Thick Film Integrated Circuits. Thick film, thin film Thick Film Integrated Circuits are crossed in some applications. Thick film process technology is relatively simple, circuit design flexibility, short production cycle, good heat dissipation, so in the high-voltage, high power and passive components of the requirements of the circuit is not too harsh use more widely. In addition, due to the thick film circuit in the process of manufacturing easy to achieve multi-layer wiring, beyond the monolithic Thick Film Integrated Circuit capacity and more complex applications, large-scale Thick Film Integrated Circuit chip can be assembled into very large scale Thick Film Integrated Circuit, Function or multi-function monolithic Thick Film Integrated Circuit chip assembled into a multi-functional parts or even small machine.

Monolithic Thick Film Integrated Circuits in addition to the development of higher integration, but also toward the high-power, linear, high-frequency circuits and analog circuits development. However, in the microwave Thick Film Integrated Circuits, large power Thick Film Integrated Circuits, thin film, thick film hybrid Thick Film Integrated Circuit also has advantages. In the specific selection, often the various types of monolithic Thick Film Integrated Circuits and thick film, film integration process together, especially as a precision resistor network and RC network substrate attached to the thick film resistors and conduction band assembled into the substrate , Loaded into a complex complete circuit. If necessary, even with the individual ultra-small components, components or machine.