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Thick Film Circuit Large Insulation Resistance, High Pressure Resistance, Stable And Reliable

Thick Film Circuit is a film layer which is formed by printing sintering technology on substrates with a thickness of several microns to dozens of microns. The material that makes this film layer is called Thick Film Circuit material.

Thick Film Circuit material is a kind of paint or slurry, which is formed by one or several solid particles (0. $number Micron) suspended evenly in the carrier. In order to facilitate printing, the slurry must have the appropriate viscosity and thixotropy (the viscosity changes with the external force of the property). Solid particles are part of a Thick Film Circuit that determines the nature and use of membranes. The carrier decomposes and escapes during the sintering process. The carrier contains at least three ingredients, resin or polymer adhesives, solvents and surface activators. The binder provides the basic rheological properties of the slurry, and the solvent dilution resin is then evaporated to dry up the printing pattern, and the activator causes the solid particles to be infiltrated and dispersed in the carrier properly.

According to the nature and use of Thick Film Circuit, there are five types of slurry used: conductor, resistance, dielectric, insulation and encapsulation slurry.

The conductor slurry is used to make Thick Film Circuit conductors, forming interconnects, multi-layer wiring, microstrip lines, welding zones, Thick Film Circuit resistor end, Thick Film Circuit capacitor plate and low resistance resistance in Thick Film Circuit circuit. Welding area is used to weld or paste discrete components, devices and external lines, and sometimes to weld the metal cover to achieve the entire block of substrate encapsulation. Thick Film Circuit conductor of different uses, there is no one slurry to meet all these uses requirements, so use a variety of conductor slurry. The common requirement of conductor slurry is large electrical conductivity, adhesion, anti-aging, low cost and easy welding. The metal compositions in the commonly used conductor slurry are gold or gold-platinum, palladium-gold, palladium-silver, platinum-silver and palladium-copper-silver.

In the Thick Film Circuit conductor slurry, in addition to the particle size suitable metal powder or the metal organic compound, also has the grain size and the shape all suitable glass powder or the metal oxide, as well as the suspension solid particle organic carrier. The glass can be firmly bonded to the substrate, forming a Thick Film Circuit conductor. Commonly used alkali-free glass, such as boron-silicon lead glass.

Thick Film Circuit resistor is a Thick Film Circuit element which has the earliest development and the highest manufacturing level, and can produce various resistors. The main requirement of Thick Film Circuit resistance is high resistivity, low resistance temperature coefficient and good stability.

The same as the conductor slurry, the resistance slurry also has three kinds of components: conductor, glass and carrier. However, its conductor is usually not a metal element, but a compound of metal elements, or a compound of metallic elements and their oxides. The commonly used slurry is platinum base, ruthenium base and palladium base resistance slurry.

Thick Film Circuit medium is used to make miniature Thick Film Circuit capacitors. The basic requirement is that the dielectric constant is large, the loss angle tangent is small, the insulation resistance is large, the pressure is high, and the stability is reliable.

The medium slurry is made from low melting glass and ceramic powder particles suspended evenly in the organic carrier. Commonly used ceramics are barium, strontium, calcium titanate ceramics. To change the relative content of glass and ceramics or the composition of ceramic, we can get the Thick Film Circuit with various properties to meet the need of producing all kinds of Thick Film Circuit capacitors.

Thick-film insulation is used as an insulating layer for multi-layer wiring and cross lines. The requirement is that the insulation resistance is high and the dielectric constant is small, and the line expansion coefficient can be matched with other film layers. The solid particles commonly used in insulating slurry are alkali-free glass and ceramic powders.