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The development direction of thick film circuit

At present, the thick film circuit is also a huge threat of competition. The continuous improvement of printed circuit boards chased the development of thick film hybrid integrated circuits. In the case of rapid change and fierce competition, we must further explore the existing problems of thick film hybrid integrated circuits and the corresponding measures taken: the development of inexpensive high quality of the new substrate materials. Slurry and encapsulation material, such as SIC substrate. Enamel substrate. G-10 epoxy resin board, base metal slurry. Resin paste, etc., high temperature stability of the packaging materials and glass cryogenic encapsulation materials. Using a variety of new chip components, such as micro-package structure devices (SOT), power micro-molded tube, high-power transistors, a variety of semiconductor integrated circuit chips, various chip resistors. Capacitor. Inductors with a variety of chip adjustable devices. R network. C network. RC network. Diode network. Transistor network and so on. Development and application of multi-layer wiring. High-density assembly and three-dimensional circuit, to the unit system with large-scale thick-film hybrid integrated circuit development. Give full play to the thick film hybrid integrated circuit expertise, continue to multi-function. High-power direction, and continuously improve the materials and processes to further improve product stability and reliability, reduce production costs to enhance the vitality of thick-film hybrid integrated circuits and in the electronic product market competitiveness. On the basis of the use of thick film integration technology, the integrated use of surface assembly technology. Thin film integration technology. Semiconductor micro-processing technology and a variety of special processing technology, the preparation of multi-species. Multifunction. high performance. Low-cost microcircuits, such as thick film microchip circuits. Thick film hybrid integrated circuit. 

Thick film sensors and other new circuits. Promotion of CAD.CAM and CAT technology in thick film hybrid integrated circuit design and manufacturing process applications, the production process gradually to the mechanization. semi-automatic. Fully automated direction of the transition, and continuously improve production efficiency. Reduce the cost of production and improve the reliability of thick film hybrid integrated circuits.